Commission Delegated Directive (EU) 2019/172 of 16 November 2018 amending, for the purposes of adapting to scientific and technical progress, Annex III to Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
Proposed act with possible EEA relevance
Adopted act under scrutiny by EEA EFTA
Draft Joint Committee Decision (JCD) under consideration
Entry into force of Joint Committee Decision (JCD) pending
Incorporated into the EEA Agreement and in force
Incorporated into the EEA Agreement but no longer in force
Legal status
Draft Joint Committee Decision (JCD) under consideration by the EU (EEAS) and the EFTA States (Iceland, Liechtenstein and Norway) Area (EEA Agreement)
II Technical Regulations, Standards, Testing and Certification
II.XV Dangerous Substances
Legal documents
Commission Delegated Directive (EU) 2019/172 of 16 November 2018 amending, for the purposes of adapting to scientific and technical progress, Annex III to Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
Delegierte Richtlinie (EU) 2019/172 der Kommission vom 16. November 2018 zur Änderung — zwecks Anpassung an den wissenschaftlichen und technischen Fortschritt — des Anhangs III der Richtlinie 2011/65/EU des Europäischen Parlaments und des Rates hinsichtlich einer Ausnahme für Blei in Loten zum Herstellen einer stabilen elektrischen Verbindung zwischen dem Halbleiterchip und dem Schaltungsträger in integrierten Flip-Chip-Baugruppen
History
10.04.2019
Draft Joint Commitee Decision (JCD) incorporating the act into the EEA Agreement sent to Commission
16.11.2018
Adoption date in the EU
01.03.2020
Compliance date in the EU
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