Commission Delegated Directive (EU) 2019/172 of 16 November 2018 amending, for the purposes of adapting to scientific and technical progress, Annex III to Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
Proposed act with possible EEA relevance
Act under scrutiny by EEA EFTA
Draft Joint Committee Decision (JCD) under consideration
Entry into force of Joint Committee Decision (JCD) pending
Incorporated into the EEA Agreement and in force
Incorporated into the EEA Agreement but no longer in force
Legal status
EU legal act incorporated into the EEA Agreement by a Joint Committee Decision (JCD) Area (EEA Agreement)
II Technical Regulations, Standards, Testing and Certification
II.XV Dangerous Substances
Joint committee decision (JCD)
153/2019 In force in the EEA
Yes Legal documents
Commission Delegated Directive (EU) 2019/172 of 16 November 2018 amending, for the purposes of adapting to scientific and technical progress, Annex III to Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
Framseld tilskipun framkvæmdastjórnarinnar (ESB) 2019/172 frá 16. nóvember 2018 um breytingu á III. viðauka við tilskipun Evrópuþingsins og ráðsins 2011/65/ESB, að því er varðar undanþágu fyrir blý í lóðningarefni til að koma á stöðugri raftengingu á milli hálfleiðaraflögu og burðarefnis í samrásastöflum af viðsnúnum flögum, í því skyni að laga viðaukann að framförum á sviði vísinda og tækni
Delegierte Richtlinie (EU) 2019/172 der Kommission vom 16. November 2018 zur Änderung — zwecks Anpassung an den wissenschaftlichen und technischen Fortschritt — des Anhangs III der Richtlinie 2011/65/EU des Europäischen Parlaments und des Rates hinsichtlich einer Ausnahme für Blei in Loten zum Herstellen einer stabilen elektrischen Verbindung zwischen dem Halbleiterchip und dem Schaltungsträger in integrierten Flip-Chip-Baugruppen
Delegert kommisjonsdirektiv (EU) 2019/172 av 16. november 2018 om endring, med sikte på tilpasning til den vitenskapelige og tekniske utviklingen, av vedlegg III til europaparlaments- og rådsdirektiv 2011/65/EU med hensyn til unntak for bly i loddematerialer for å oppnå en stabil elektrisk forbindelse mellom halvlederskive og kapsling i Flip Chip-pakker med integrerte kretser
History
15.06.2019
Adopted JCD confirmed entry into force date
01.03.2020
Compliance date in the EEA
14.06.2019
Adoption of Joint Commitee Decision (JCD) incorporating the act into the EEA Agreement
10.04.2019
Draft Joint Commitee Decision (JCD) incorporating the act into the EEA Agreement sent to Commission
16.11.2018
Adoption date in the EU
01.03.2020
Compliance date in the EU
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